Degree in Electronics Engineering
Degree in Mechanical Engineering
AI Robotic systems, Design, Effective communication skills, Microsoft Office suites, Operations, Writing
Working within the Lab Operations organization will have as main duties the support of the daily lab tools operations.
Minimum Qualifications
Preferred Qualifications
This position is subject to the Austrian Collective Bargaining Agreement for Employees in the Metal Technology Industryin occupation group D or E, depending on the education. A higher payment is negotiable depending on expertise and skills. The monthly salary is paid 14 times per year.
Villach - a great place to live and work
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Our Commitment
We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.
Lam Research (Lam or the Company) is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.
Job Segment: Facilities, Manufacturing Engineer, Electrical, Engineer, Operations, Engineering, Research
Lam Research Corporation is an American supplier of wafer fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing market
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