Java Programming, Python Programming, C++, C Programming, SQL, Cloud computing, Scala Programming, Machine learning techniques, Data science techniques, MATLAB Programming, PyTorch, TensorFlow, R Programming
In Lam’s Computational Products group, we build compelling software products to solve semiconductor technology challenges. Our leading 3D modeling software is revolutionizing the way that semiconductor chips are fabricated around the world, and is enhancing the value of Lam’s semiconductor process equipment. Computational Products is a successful, agile software organization with a culture of engineering excellence and strong relationships. Our software products are envisioned and created by world-class engineers in many disciplines: software engineering, numerical physics, data science, electrical engineering, quality assurance and development operations.
As Data Science Director, you will play an essential leadership role in improving our software products through data science. You will use your experience in data science and management to guide the group to success, reinforcing a culture of strong engineering process, collaboration, and focus on objectives. Your passion for data science will inspire and motivate the team as you mentor the existing staff and scale the team up. You will collaborate closely with program stakeholders to identify opportunities for data science, define deliverables, and steer the team to successful completion of their objectives.
Minimum Qualifications
Preferred Qualifications
Our Commitment
We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.
Lam Research Corporation is an American supplier of wafer fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing market
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