Degree in Computational Materials Science
Degree in Electrical Engineering
Job Responsibilities
The engineer will be part of a team that drives tool development and insight into semiconductor fabrication equipment through modeling and simulation of RF systems and Multiphysics phenomena involving low temperature process plasmas. We are looking for a candidate with strong fundamentals in plasma physics, electromagnetics, gas dynamics, heat transfer and fluid flow, and experience in computational plasmas, EM modeling, numerical methods, & chemical reaction kinetics.
Other Job Responsibilities
Minimum Qualifications
Our Commitment
We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.
Lam Research (Lam or the Company) is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.
The successful candidate for this position will become eligible for a comprehensive set of outstanding benefits. Click here to learn more about the benefits Lam offers for this position www.lambenefits.com.
Lam Research Corporation is an American supplier of wafer fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing market
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