Sr. Staff/Principal Engineer, SI/PI (Signal Integrity/Power Integrity)

Key Skills

Aartificial intelligence, Design, Effective communication skills, Leadership Skill, Python Programming

Job Description

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Responsibilities:

• Lead SI & PI efforts for highspeed AI computing hardware across global markets, includes PCB stackup design, material comparison, vendor approval, design guideline creation and review.
• Model extraction (S-parameter, RLGC, ...) from passive channels on PCBs & cables including connectors.
• Manage global ODMs’ highspeed lead, engage in discussion, review & suggestions for SI works pre-layout, post & debug work in close contact with suppliers.
• Cooperate closely with package, board layout, and supply chain in identifying the best solutions for highest system SI/PI performance.
• Architect, design and optimizing the Power Delivery Network (PDN) on PCBs and the full system (secondary).
• Work closely with Field Application Engineers to enable customer system designs for the best SI/PI performance.
• Develop and maintain technical documentation, including design guidelines, test flows, test reports and feed into Jira & confluence system.
• Highspeed scope, TDR & VNA measurement for board material, cable characterization and model correlation.
• Train internal members (EE & Layout) on best SI/PI practices and industry trends.

Experience & Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Microwave, or a related field.\
• 7+ years of experience in SI/PI and product design & manufacturing for computing and/or networking hardware.
• Hands on knowledge with ADS, HFSS/3D, Sigrity (Clarity/PowerSI), Hspice or similar industry standard simulation tools.
• Extensive knowledge of Interfaces like GDDR, LPDDR, DDR, PCIe Gen 5 & 6, Ethernet IEEE 802.3 all speeds, USB, etc.
• Knowledge of various signaling modulations like NRZ, PAM4 (optional).
• Experience with measurements & standards compliance procedures.
• Experience with Cadence Allegro PCB designer and/or Altium, Constraints Manager and or other PCB stack up designer tools.
• ASIC package (also advanced packaging, HBM, chiplets) exposure is a strong plus.
• Deep knowledge of impacts of high-volume PCB manufacturing on Signal & Power integrity.
• Familiarity with high-performance computing, data center equipment, and consumer electronics.
• Limited scripting knowledge (python, shell) may be needed.
• Strong problem-solving and analytical skills to diagnose and resolve SI/PI failures.
• Excellent communication skills to support internal teams and global customers.
• Ability to travel internationally (up to 5%) to support testing, supplier visits, and customers & ODM engagements.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.